Applied Materials, Intel collaborate at EPIC Center to accelerate AI chipmaking, advanced packaging
NEW DELHI: Materials engineering major Applied Materials on Thursday announced a collaboration with Intel Corporation to accelerate the development of chipmaking innovations for next-generation transistors, interconnects, and advanced packaging technologies. The joint effort brings together capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon, to shorten time-to-market for advanced semiconductor technologies essential to artificial intelligence computing.
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Applied Materials, Intel collaborate at EPIC Center to accelerate AI chipmaking, advanced packaging Why it matters: Research is moving the AI stack right now, and this update helps explain what changed for builders. Source: Telecomliveweb https://a2zai.ai/bytes/applied-mater...
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