Dragonwing expands access to intelligent connected devices

Noting that demand is growing for devices that can perceive, analyse and act on data locally, Qualcomm Technologies has launched the Dragonwing Q-2390 and IQ-2390 processors, a range of systems designed to enable a new class of intelligent commercial and consumer devices. The launch expands the Dragonwing portfolio with what are highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. Introduced in February 2025, the Dragonwing brand represents Qualcomm’s industrial and embedded internet of things (IoT), networking and cellular infrastructure services with an emphasis on industrial applications. At launch, Qualcomm said that in a world where companies face the “daunting” challenge of transforming and growing with new technologies and digital systems, the portfolio would empower company growth, productivity and competitiveness at a global scale. Dragonwing products are said to be built to support edge intelligence custom-designed for business and industry with on-device hardware and software artificial intelligence (AI) offerings seeing use in a number of use cases. The claimed result is that IoT services can be used in simplifying complexity, empowering smarter decision-making and optimising operational efficiency, forming what Qualcomm said would be “blueprints for industry transformation”, from enhancing everyday needs to solving the world’s most mission-critical challenges. In establishing the brand identity, the connected processor and artificial intelligence company said it aims to empower customers in industries such as energy and utilities, retail, supply chain, manufacturing and telecoms to “grow, innovate and scale to new heights”. The Dragonwing Q2 Series and Dragonwing Q-2390 processors are designed with capabilities to support applications ranging from retail and smart home products to and enterprise edge devices and helping power what Qualcomm says will be the next wave of intelligence across homes, businesses, cities and factories. They will see use in applications ranging from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Explaining why Qualcomm believes there is a need for the processors, Jeff Arnold, vice-president and general manager of auto telematics, industrial and embedded IoT, consumer, and connectivity at Qualcomm Technologies, said: “AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration. With the Dragonwing Q-2390 and IQ-2390 processors, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before.” Read more about IoT processors CES 2026 – AI gets physical : Continuing our round-up of this year’s CES, we look at key use cases and how the generation of artificial intelligence and connected devices will evolve. Ericsson, Net Feasa deliver maritime connectivity with 4G, 5G, agentic AI : Partnership looks to provide the maritime industry with reliable, secure connectivity, integrated with agentic AI-driven tech in use cases including reefer monitoring, dangerous goods handling and heat monitoring. Neura Robotics accelerates next-generation physical AI : Robotics firm inks strategic collaboration with chip giant to advance next-generation robotics and physical AI, and work jointly on reference architectures for full-stack robotics systems. Telefónica and Halotech drive smart industrial safety with IoT and AI : Firms unite to offer advanced industrial safety solutions, combining IoT connectivity with AI-powered sensors, to anticipate risk situations. The Dragonwing IQ-2390 processor is the first product in the Dragonwing IQ2 Series, a family of industrial edge AI processors designed to extend intelligent computing to a broader range of industrial and compute applications. It integrates AI, vision, deterministic networking and real-time processing for industrial automation, machine vision, building management and energy systems. Complementing the Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series portfolios, Dragonwing IQ-2390 aims to bring intelligence to compact edge systems that require reliable operation, real-time responsiveness and long product lifecycles across industrial automation, oil and gas, utilities, and energy applications. Combining application processing, machine vision, AI acceleration and dual gigabit Ethernet with time-sensitive networking, Dragonwing IQ-2390 processor is said to enable smarter HMIs, PLCs, gateways, industrial vision systems, building automation platforms and energy management services. The processor is designed to support operation across an extended temperature range of -30°C to +115°C, and also includes features intended to support operation in environments subject to vibration and shock. This, said Qualcomm, makes it well-suited for performance in factories, energy infrastructure and outdoor industrial environments. The result is a highly integrated architecture that aims to simplify deployment of AI-enabled industrial systems while helping manufacturers reduce bill of materials, board space and integration complexity, all in a ruggedised package that demanding industrial applications require. The Q-2390 processor is designed for edge-intelligent commercial, enterprise and consumer products that require advanced capabilities within tight cost, power and size constraints. By integrating application compute, on-device AI, camera and display support, LTE Cat 4 and GPS location capabilities, flexible wired and wireless connectivity options, security and extensive input/output capabilities into a single platform, Dragonwing Q-2390 is claimed to be able to support a new generation of intelligent connected products. Intended applications Key intended applications include retail point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture , home robots, fitness equipment and enterprise terminals, helping device makers deliver richer user experiences while reducing system complexity and development costs. Both processors feature a quad-core Qualcomm Kryo central processing unit, a Qualcomm Adreno 704 graphics processing unit and a real-time Risc-V MCU. Combined, these platforms are seen as making it possible to enable original equipment manufacturers and developers to build smarter connected devices while reducing design complexity, lowering system cost and accelerating time-to-market. Evaluation kits for both platforms are expected to be available in early 2027. Customer engagement for the Dragonwing Q-2390 and IQ-2390 is already underway through an early access programme. “At Eight Development , we build scalable platforms that support mission-critical products across security, fire, life safety, and building automation, so every technology decision has to serve an entire product family for years to come,” said the company’s CEO and founder, Jason Mackie. “With an integrated real-time MCU and a place within the broader Dragonwing portfolio, the Q-2390 helps us simplify system design while giving customers a platform that can scale across product tiers and generations.” Lorenzo Veltroni, chief product and marketing officer at Seco, which creates industrial intelligence systems through edge AI and physical AI, said: “At SECO, our goal is to help customers move from concept to deployment faster with production-ready hardware and software platforms. “With Compact Vision 5 with Dragonwing IQ-2390 and SBC with Dragonwing-IQ-2390, we provide two complementary solutions built on the Dragonwing IQ-2390 platform, giving developers a streamlined path to bring intelligent industrial devices to market. Combined with the Clea software framework, they create a scalable foundation for connected products, edge AI and long-term lifecycle management.”