Micron Powers AI Everywhere at COMPUTEX 2026

TAIPEI, Taiwan, June 01, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (NASDAQ: MU ) today announced a showcase of its full portfolio of AI-optimized memory and storage solutions during COMPUTEX 2026, empowering next-generation AI data center and intelligent edge applications. As AI workloads expand from training to large-scale inference, including reasoning-heavy and agent-based systems, the demands on memory and storage are intensifying across every layer of the compute stack and memory hierarchy. "AI context lengths are increasing by 30 times per year, 1 while memory content per server has doubled in the past three years, 2 " said Sumit Sadana, EVP and Chief Business Officer at Micron Technology. "System performance is now driven by memory bandwidth and memory capacity, more than ever before. This structural shift in the semiconductor ecosystem makes memory and storage indispensable strategic assets – and Micron is leading with a range of industry-first and industry's best products, from HBM to DRAM and NAND solutions designed for the AI era." Memory and storage as the foundation of AI data center performance Micron's data center memory and storage portfolio is purpose-built to address every layer of the AI infrastructure hierarchy. High-bandwidth memory (HBM) powers high-speed model execution and hot key-value (KV) cache, while LPDDR and DDR deliver system memory for orchestration and long-context expansion (with LPDDR offering greater power efficiency). Data center SSDs round out the stack, offering high-performance drives to address persistent KV cache needs and high-capacity drives for massive data lakes. This tiered memory architecture, with Micron at the heart of every layer, optimizes latency, bandwidth, power, capacity and cost — offloading GPUs to maximize data center token production. Micron's latest milestones across the portfolio demonstrate this momentum: HBM: HBM4 36GB 12H enables a 2.6-times increase in large language model (LLM) inference throughput, measured in tokens per second for every 2-times increase in bandwidth. 3 SOCAMM: Micron is the only provider of a 256GB SOCAMM2, the world's highest capacity offering, extending leadership in low-power data center memory by delivering one-third the power and one-third the footprint versus standard RDIMMs. 4 High-capacity RDIMMs: Micron sampled the company's leading-edge 1γ (1 gamma) technology in the 256GB DDR5 RDIMM, which is capable of speeds up to ... Full story available on Benzinga.com