NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging
The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity. A Malaysian startup now wants to solve part of that problem at the material boundary level. Kuala Lumpur-based nanoSkunkWorkX (nSWX) has [...] The post NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging appeared first on e27 .
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NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging Why it matters: AI News is moving the AI stack right now, and this update helps explain what changed for builders. Source: E27 https://a2zai.ai/bytes/nasa-linked-mit-trained-founders-nswx-raises-us-2m...
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