Samsung unveils HBM5 mock-up at Taiwan trade show

Samsung Electronics unveiled a mock-up of its next-generation high-bandwidth memory 5 (HBM5) chip for the first time at COMPUTEX 2026 in Taiwan, Tuesday. Song Jai-hyuk, president and chief technology officer at Samsung’s Device Solutions Division, displayed the firm’s strong willingness to lead the technological leadership in the next-generation HBM market by deepening partnerships with global firms. “We will continue to strengthen our technological competitiveness in the next-generation memory chips by teaming up with global firms, such as Nvidia,” Song said at the exhibition. He also underscored the importance of thermal management technology amid the booming artificial intelligence (AI) industry. As AI systems grow more powerful and densely integrated, thermal management and data processing efficiency are emerging as key competitive differentiators along with the performance of memory chips, according to Song. Central to Samsung’s HBM5 strategy is its proprietary Heat Path Block (HPB) technology. HPB helps lower thermal resistance and improve operational stability to address